產(chǎn)品展廳
|
Vespel SCP-5050 PI DuPont 杜邦
- 品牌：DuPont 杜邦
- 價格： ￥13.7/千克
- 發(fā)布日期： 2024-08-09
- 更新日期： 2025-09-01
產(chǎn)品詳請
| 品牌 | DuPont 杜邦 |
| 貨號 | |
| 用途 | 杜邦? Vespel? SCP-5050 零件和形狀可提高高溫性能和耐磨性,從而可以更換金屬和石墨部件。Vespel? SCP-5050 的部件和形狀可實現(xiàn)更高效、更耐用的系統(tǒng)、更高的性能并降低維護成本。SCP-5050的熱膨脹系數(shù)(CTE)與鋼相似。 |
| 牌號 | Vespel SCP-5050 |
| 型號 | Vespel SCP-5050 |
| 品名 | 聚酰亞胺類 |
| 包裝規(guī)格 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 外形尺寸 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 生產(chǎn)企業(yè) | DuPont 杜邦 |
| 是否進口 |
Vespel 是杜邦公司生產(chǎn)的一系列耐用高性能聚酰亞胺基塑料的商標。
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術(shù)。它結(jié)合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產(chǎn)生明顯的釋氣,這使得它可用于輕質(zhì)隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結(jié)合是 Vespel 的主要優(yōu)勢。
熱物理性質(zhì)
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經(jīng)發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質(zhì)都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產(chǎn),DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產(chǎn)的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產(chǎn)的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質(zhì),而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質(zhì)。
標準聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級,可實現(xiàn)最小的導電性和導熱性。這是未填充的基質(zhì)聚酰亞胺樹脂。它還提供高物理強度和 伸長率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計),SP-21添加到基礎(chǔ)樹脂中,可提高耐磨性并減少摩擦,適用于滑動軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應用。這種化合物具有石墨填充等級中 的機械性能,但低于原始等級。示例:Vespel SP-21。40%石墨(按重量計),SP-22增強耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計),SP-211添加到基礎(chǔ)樹脂中,可在各種操作條件下實現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達 149 °C (300 °F)。典型應用包括滑動軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤滑劑),SP-3在真空和其他無濕環(huán)境中,石墨實際上會變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應用包括密封件、滑動軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過等靜壓成型和機械加工生產(chǎn))
財產(chǎn) 單位 測試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無量 綱 在 100 Hz 時 3.62 13.53
在 10 kHz 時 3.64 13.28
在 1 MHz 時 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.101
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經(jīng)過驗證的強度、耐磨性和低摩擦。
發(fā)動機部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術(shù)。它結(jié)合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產(chǎn)生明顯的釋氣,這使得它可用于輕質(zhì)隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結(jié)合是 Vespel 的主要優(yōu)勢。
熱物理性質(zhì)
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經(jīng)發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質(zhì)都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產(chǎn),DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產(chǎn)的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產(chǎn)的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質(zhì),而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質(zhì)。
標準聚酰亞胺化合物的一些例子是:
SP-1原生聚酰亞胺提供從低溫到 300 °C (570 °F) 的工作溫度、高等離子體電阻以及 UL 等級,可實現(xiàn)最小的導電性和導熱性。這是未填充的基質(zhì)聚酰亞胺樹脂。它還提供高物理強度和 伸長率,以及 的電氣和熱絕緣值。示例:Vespel SP-1。15%石墨(按重量計),SP-21添加到基礎(chǔ)樹脂中,可提高耐磨性并減少摩擦,適用于滑動軸承、止推墊圈、密封環(huán)、滑塊和其他磨損應用。這種化合物具有石墨填充等級中 的機械性能,但低于原始等級。示例:Vespel SP-21。40%石墨(按重量計),SP-22增強耐磨性、降低摩擦、提高尺寸穩(wěn)定性(低熱膨脹系數(shù))和抗氧化穩(wěn)定性。示例:Vespel SP-22。10%聚四氟乙烯和15%石墨(按重量計),SP-211添加到基礎(chǔ)樹脂中,可在各種操作條件下實現(xiàn) 的摩擦系數(shù)。它還具有出色的耐磨性, 可達 149 °C (300 °F)。典型應用包括滑動軸承或直線軸承,以及上面列出的許多磨損和摩擦用途。示例:Vespel SP-211。15%填充鉬(二硫化鉬固體潤滑劑),SP-3在真空和其他無濕環(huán)境中,石墨實際上會變得具有磨蝕性,具有耐磨性和耐摩擦性。典型應用包括密封件、滑動軸承、齒輪和外太空中的其他磨損表面、超高真空或干燥氣體應用。示例:Vespel SP-3。
材料屬性數(shù)據(jù)
Vespel的材料特性(通過等靜壓成型和機械加工生產(chǎn))
財產(chǎn) 單位 測試
條件 SP-1
(未填充) SP-21
(15%石墨) SP-22
(40%石墨) SP-211
(10%聚四氟乙烯,
15%石墨) SP-3
(15%鉬
2)
比重 無量 綱 1.43 1.51 1.65 1.55 1.60
熱膨脹
系數(shù) 10?6/K 211–296 千米 45 34 27 [9]
296–573 千米 54 49 38 54 52
導熱 W/mK 在 313 K 0.35 0.87 1.73 0.76 0.47
體積電阻率 Ω·米 在 296 K 1014-10 15 1012-10 13
介電常數(shù) 無量 綱 在 100 Hz 時 3.62 13.53
在 10 kHz 時 3.64 13.28
在 1 MHz 時 3.55 13.41
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.101
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經(jīng)過驗證的強度、耐磨性和低摩擦。
發(fā)動機部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
Vespel® SCP-5050 減輕重量并延長裹尸布壽命
個案研究
由耐高溫的 VespelSCP-5050 復合材料制成的噴氣發(fā)動機護罩具有經(jīng)過驗證的抗沖擊性，并可能顯著減輕重量（與鋁相比減少 40%，與不銹鋼和鈦相比減少 75%）。使用 VespelSCP-5050 制成的護罩還具有更長的部件壽命，這要歸功于減少了磨損界面、整個護罩使用了軸承材料以及消除了襯套壽命問題。® ®
復合護罩提供低摩擦、耐磨的表面，可防止損壞昂貴的金屬葉片桿。此外，VespelSCP-5050 可以簡化設(shè)計和組裝，使用這種材料實現(xiàn)的重量減輕有助于提高飛機的燃油效率、航程和有效載荷能力。®
應用
護罩是一個分段環(huán)，其孔徑向向外鉆孔，用于噴氣發(fā)動機壓縮機內(nèi)部使用的可變?nèi)~片桿。有些是分裂的。
凹槽被切成護罩以接受金屬連接環(huán)，通常帶有可磨損的密封。
護罩通常是鋁、不銹鋼或鈦。
護罩利用襯套來增強磨損并減少可變?nèi)~片桿的摩擦。
內(nèi)罩通常漂浮在發(fā)動機軸線上。
挑戰(zhàn)
如果襯套過早磨損，昂貴的金屬部件（如葉片）可能會損壞。
組件需要在預期的發(fā)動機使用壽命內(nèi)承受熱偏移。
護罩需要承受沖擊、負載并保持葉片的相對位置。
護罩的設(shè)計需要允許與多個葉片同時組裝。
更強的耐熱磨損性
杜邦 Vespel 在高溫下的耐磨性圖表
溶液
設(shè)計護罩采用輕質(zhì)、耐高溫、耐磨的 VespelSCP-5050 復合材料代替金屬。®
特點和優(yōu)勢
在超過 600F/315C 的應用環(huán)境中具有耐高溫材料的能力?！恪?br />
由于減少了磨損界面，整個護罩使用軸承材料，并消除了襯套壽命問題，因此延長了部件壽命。
久經(jīng)考驗的抗沖擊性。
由于復合材料的密度較低，與鋁相比，重量可能減輕 40%，與不銹鋼和鈦相比，重量可能減輕 75%。
通過消除襯套，減少需要庫存和組裝的零件。
通過部件整合降低系統(tǒng)成本。
提供盡可能大的子組件。
與動態(tài)系數(shù)為 .2 或更低的金屬相比，摩擦力更低。
復合材料與金屬的減振性能。
